The Chilldyne Starter Kit makes it easy for data centers to bring liquid-cooling in thanks to non-spill negative pressure and redundant CDUs.
Chilldyne, a direct-to-chip liquid cooling provider, announced the release of its Data Center Liquid Cooling Starter Kit. This easy-to-consume package is designed to equip data centers to handle the demanding workloads driven by AI/HPC computing. As data center operators face high-density racks of up to 150 kW and anticipate even higher capacities in the future, they require something other than air cooling.
Dr. Steve Harrington, CEO of Chilldyne, offered: “We are excited to introduce our data center liquid cooling starter kit to the market. Our goal is to develop real, practical liquid cooling solutions that address the growing challenges faced by HPC and colocation data center operators in the era of artificial intelligence. By offering a Liquid Cooling Starter Kit capable of supporting high-density racks, we are confident that we can help our customers achieve their goals of increased efficiency, sustainability, and reliability.”
Chilldyne’s liquid cooling technology features a patented negative pressure system designed to eliminate the risk of coolant leaks, providing a reliable and efficient solution for data centers transitioning to liquid cooling. This plug-and-play solution allows data center operators to rapidly demonstrate and gain experience with Chilldyne’s leak-free technology. Additionally, it provides a foundation for fully deploying liquid cooling solutions essential for AI data centers. The kit simplifies the integration of liquid cooling capabilities into existing data center infrastructures.
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Standard Starter Kit Includes:
- Two CF-CDU300 Cooling Distribution Units (CDUs)
- Cold Plates: These plates are rated up to 2,000-watt TDP and have hybrid air-liquid options for backup cooling. They are compatible with CPUs and GPUs from NVIDIA, Intel, AMD, and other manufacturers.
- Automatic Switchover Valves: The quantity is dependent on the number of racks.
Key Features:
- Dual Redundant Cooling Feeds: Each rack has dual redundant cooling feeds with automatic switchover valves.
- High Coolant Flow: Capable of up to 300 liters per minute (lpm), supporting 150 kW cooling per rack.
- Efficient Heat Removal: Capable of removing 375 kW of heat with 80% heat capture into liquid and up to 500 kW with 60% heat capture.
The A/B redundant liquid cooling system ensures maximum uptime and reliability for data centers. Chilldyne’s Liquid Cooling Kits are designed with no single point of failure, include automatic coolant quality control, and are modular, allowing for expansion with additional CDUs for increased thermal capacity.
Chilldyne has received over $1.2 million in grants from the U.S. Department of Energy’s Advanced Research Projects Agency-Energy (ARPA-E) under the COOLERCHIPS program. This support is for developing Chilldyne’s high-performance liquid cooling systems, further underscoring the company’s commitment to advancing data center cooling technology.
More information is available on the Chilldyne website.
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