Solidigm unveils a liquid-cooled SSD for AI servers at GTC 2025, enabling fully fanless, high-performance AI infrastructure.
Solidigm, a leader in enterprise data storage, has launched one of the world’s first liquid-cooled enterprise solid-state drives at the GTC AI Conference. This breakthrough technology eliminates the need for fans in storage devices, enabling the development of fully liquid-cooled artificial intelligence (AI) servers.
The Future of AI Server Cooling is Here
The increasing adoption of AI servers drives a shift in data center infrastructure, with more capital expenditure (CapEx) now directed toward AI servers than general-purpose servers. AI server units are experiencing a compound annual growth rate (CAGR) four to five times higher than their general-purpose counterparts. Many AI servers today require over 30TB of storage per unit. With projections indicating 2 million AI server units shipping in 2025, SSDs could significantly impact AI outcomes.
Until now, component-specific cooling challenges have limited the implementation of fully liquid-cooled AI training servers. Traditional SSD direct liquid cooling (DLC) solutions only cool one side of each SSD and do not allow for hot swapping, presenting hurdles for efficient server management. Solidigm has worked closely with NVIDIA to address these challenges, developing the industry’s first cold-plate-cooled eSSDs featuring the Solidigm D7-PS1010 E1.S 9.5mm form factor.
Enabling Compact, Energy-Efficient AI Infrastructure
This new technology provides a groundbreaking solution for AI server infrastructure by:
- Reducing HVAC costs for critical IT infrastructure
- Supporting full eSSD serviceability, including hot swapping
- Enabling complete fan removal for compact 1U AI server designs
- Eliminating costly air cooling solutions with a 100% liquid-cooled approach
By leveraging the E1.S SSD form factor and its proprietary liquid cold-plate kit, Solidigm sets a new standard in AI server cooling efficiency while maintaining data center-grade serviceability. Compared to traditional air cooling, which typically provides uniform cooling from all sides of the drive, a residual problem with single-sided liquid cooling is that it can leave components on the opposite side running warmer, which could lead to performance issues.
However, Solidigm’s proprietary E1.S SSD case design effectively addresses this by distributing heat from the non-contact side through the case to the side that makes contact with the cold plate. This ensures efficient cooling across all sides of the drive, enhancing thermal performance and reliability under hard workloads.
A Breakthrough in SSD Packaging
Solidigm’s reputation for innovation in enterprise SSD design has long been established, beginning with its pioneering “ruler” form factor. With this new liquid-cooled solution, the company continues its leadership in packaging advancements. The Solidigm D7-PS1010 E1.S will be available in two form factors, 9.5mm with a cold-plate kit for liquid cooling and 15mm for air-cooled server and storage systems, offering flexibility across AI infrastructure deployments.
This technology will be available for AI servers in the second half 2025. At Booth #1602, GTC attendees can see Solidigm’s latest innovations firsthand and engage with company experts.
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